Job Description

Job Description

Job Description

This role will lead and develop resources for new PIC architecture and products in the pipeline, define critical gaps for challenging assembly needs and ensure that forecasted capability and capacity requirements can be met. You will work closely with cross-functional teams to ensure robust, scalable manufacturing processes that meet performance, reliability, and cost requirements for high-volume production.

Responsibilities

Key Responsibilities:

Process Development & Sustaining
• Process ownership of Die-Attach (eutectic/epoxy), wirebonding, for PIC-based optical boards product development and sustaining in assembly area.
• Lead DOE to fine-tune critical parameters for bond strength, placement accuracy, multi-tier looping optimization and thermal performance.
• Peer-lead and develop expertise in specific assembly process modules as well as across the manufacturing process flow.
• Identify, develop, and qualify new assembly processes and technologies to enable and support
next generation product needs.

Assembly Tooling & Automation
• Specify, qualify, and maintain assembly equipment including high-precision die bonders, wire bonders.
• Drive automation and in-line inspection to improve throughput and yield for COC assembly in high-volume production environment.
• Responsible for evaluating new equipment for tool selection, procurement, qualification installation, and process/tool specs documentation.

Yield, Reliability & Quality
• Analyze and resolve process-related yield issues using structured root cause analysis (RCA) and FMEA methodologies.
• Organize, analyze, and improve manufacturing processes to meet key performance indicators including efficiency, cycle time, yield, and reliability.
• Collaborate with R&D and Quality teams to ensure design-for-assembly (DfA) and design-for-reliability (DfR).

New Product Introduction (NPI)
• Lead process qualification and pilot builds for new PIC-based product platforms, supporting ramp to production.
• Work closely with product design and packaging teams to align assembly processes with optical, thermal, and electrical performance targets.
• Work with PIC, ASIC development and other functional teams to define the assembly requirements for new product introduction, prototype assembly including hands-on machine programming.

Documentation & Control
• Develop and maintain standard operating procedures (SOPs), process flow diagrams, control plans, and SPC metrics.
• Ensure process traceability and compliance with internal and customer quality standards.

Qualifications

• Bachelor's degree in Electrical, Chemical, Mechanical, Materials Engineering, or related field, plus 10 years of related experience, or Master's Degree with 7 years of experience in semiconductor packaging & assembly technology in a manufacturing environment.
• Strong hands-on background and experience in assembly equipment and processes for microelectronics manufacturing (Datacon, ESEC/KNS Wirebond - Gold Ball bonding)
• Background in semiconductor or photonic device manufacturing, process control, and statistical tools (SPC, DOE, JMP, Minitab).
• Background in CM (Contract Manufacturer) transfer and ramp-up support is preferred.
• Hands-on data analysis with JMP, MATLAB, or similar packages
• Troubleshooting and resolving equipment related line downs.

Job Tags

Contract work,

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